We evaluated the effects of temperature on the acceleration of performance in an electrochemical migration (ECM) reliability test of an FR-4 type printed wiring board (PWB). We evaluated the accelerated test conditions from 30°C to 140°C. Our test showed that the ECM failure mode at 30°C was different from the ECM failure mode at 85°C to 140°C.
The actual failure time of the test result at 30°C was shorter than the failure time extrapolated to the failure time from 85°C to 140°C. This is because the temperature does not accelerate at temperatures between 30°C and 140°C, so it did not conform to the Arrhenius equation.