抄録
We have developed a new technology for making the build-up “Printed Wiring Board (PWB) ” which has brought the best solution to “Flip Chip Attachment (FCA) ”. The Build-up layers consist of a thin coating of high Tg Thermosetting epoxy resin. It has very small “Interstitial Blind Via Holes (IVH) ” with 80μm Min. diameter, and can achieve finer pattern (e.g. L/S=40/40μm) than the previous subtractive process. The tighter tolerance of pattern alignment (±25μm or less), is also practical with the combination of the semi-additive process and the high-performance exposure unit.
