Special Articles / Recent Progress of the Micro Mechatronics and Packaging Technology -Packaging of Large Area Integration and e-Textile Technology-
Research on Electrical Contact Structures for Woven Electronic Textiles at BEANS Project
Koji Miyake, Takahiro Yamashita, Khumpuang Sommawan, Seiichi Takamatsu, Toshihiro Itoh
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2013 Volume 16 Issue 2 Pages 96-100
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Article 1st page
