ホソカワ粉体工学振興財団年報
Online ISSN : 2189-4663
ISSN-L : 2189-4663
研究助成成果報告
キャピラリー電気浸透流を用いた粒子マニピュレーション法の開発
藤 正督高橋 実
著者情報
研究報告書・技術報告書 オープンアクセス

2005 年 13 巻 p. 69-72

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抄録

The technology to assemble particles as a method of the technique for making material in recent years attracts attention. The particle assembly technology is the technique to fabricate a new functional material and device by assembling two or three dimensional periodic structures with particles such as metals, oxides, and polymers.

It is expected that the material which has a multifunction and an intelligent function in the future can be made by assembling the particle with various functions arbitrarily.

The purpose of this study is a new technical development of the particle array with the capillary electro-osmosis used for the microanalysis method. We would like to apply the capillary electroosmosis, which is actively researched in the field of chemical analysis, as a new technology for making materials. The under mentioned merit exists when this method is applied to the material processing. An indispensable device is only a power supply. It is easy to control a quantitative particle transport which uses the electro-osmotic flow by setting an electric experiment condition. The particle can also be arranged to the non-conducting material because the electro-osmotic flow is used. The composition of the cathode or anode side solution can be changed arbitrarily and independently. This is one of methods with which the contradicted requirement of dispersion and the flocculation is satisfied at the same time. Chemical or physical condition that the particle coheres can be set on the solution side which the particle extracts. On the other hand, the condition of dispersing particles can be set on the solution side where the particle is supplied. In this paper, the particle was arranged at an arbitrary position on the substrate by using the advantages of the capillary electroosmotic methods; especially an indispensable condition to achieve a minute array was investigated.

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