抄録
Advanced micro sensors for ultrasonic imaging, pressure, acceleration, angular rate and atomic force have been realized based on silicon bulk-micromachining. Novel techniques as deep Reactive Ion Etching (RIE), XeF2 silicon etching have been developed for precise micromachining and applied for the sensors. The deep RIE of silicon has been applied for electrostatic microactuators. Parallel electrodes in a packaged glasssilicon structure enable electrostatic force balancing servo sensors, resonant sensors and electrostatically levitating micromotors. Nano-machining based on the Scanning Tunneling Microscopy (STM) technology have been also developed to fabricate extremely small structures.
