All-SiCモジュールパッケージ設計技術

抄録

We used FEM to investigate an All-SiC module packaging technology which emphasizes low inductance, low thermal impedance and small size. Low inductance, low warpage and the molding process are demonstrated by parametric simulation so that high performance and highly reliable packaging are realized. As a result, we were able to apply the All-SiC module to a mega-solar PCS which achieved 98.8% efficiency.