エレクトロニクス実装学会誌
Online ISSN : 1884-121X
Print ISSN : 1343-9677
サブミクロンAu粒子焼結体を用いた低温接合技術
小柏 俊典澁谷 忠弘宮入 正幸藤澤 良知鶴見 和則于 強
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2007 年 10 巻 7 号 p. 560-566

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This study focused on the Au Au junction, using a sub-micron gold particle with low temperature sintering. The mechanical properties and the micro-structures were measured with the microbumps of the Au sintered compact, and mechanical shear fatigue tests for flip-chip specimens were then carried out. The cluster structure of the sintered bump heated at 220°C possessed ductility and turned to a grain growth structure with thermo-compression, resulting in a densely packed structure. In the mechanical shear fatigue test for the flip-chip specimens, the number of cycles to failure for the sintered bump was superior to that of a Sn-Ag alloy solder.

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