抄録
Anisotropic conducting adhesive technology for flip chip interconnection, being actively investigated now. The new kind of Anisotropic Conductive Film (ACF) we are now developing has the following features:
1. Minimum pitch between conductive material is 0.025mm
2. Conductive material consists of linear metal material (not used small conductive particles)
3. Adhesive material consists of thermoplastic resin
4. Conductive material coated by insulator, which is a high heat distortion resin, is completely separated from the adhesive.
