Excimer-Laser-Based, Thin Beam Directional 'Xtallization (TDX) and Thin Beam Based LTPS Technology for Processing Large Area Poly-Silicon

M.Shane BOWEN; David S. KNOWLES

doi:10.2184/lsj.34.689

M.Shane BOWEN, David S. KNOWLES

著者情報

キーワード: Low-Temperature Poly-Silicon (LTPS), Thin Beam Directional Xtallization (TDX), Sequential lateral solidification (SLS), Excimer laser Annealing (ELA), Flat panel display, electronic materials

ジャーナルフリー

2006 年 34 巻 10 号 p. 689-692

DOI https://doi.org/10.2184/lsj.34.689

詳細

抄録

This paper provides a review of Thin Beam Directional 'Xtallization (TDX) technology and presents the most recent experimental results illustrating the versatility of thin beam based LTPS processes. As the TDX process moves toward full production, these results confirm the viability of using a thin beam for SLS and for micro-ELA processing as alternative, and complementary, operational modes of the TCZ-900X laser annealing tool.

責任著者(Corresponding author)

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