精密工学会学術講演会講演論文集
2005 JSPE Spring Meeting
セッションID: A38
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三次元造形(2)
Deposition of High Aspect Ratio Silver Conductive Ink for Stereolithography SFF Fabrication
*イブラヒム ムスタッファ楢原 弘之鈴木 裕是澤 宏之
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Integrating an electrical element into a prototyped part would add an entirely new dimension to the usefulness of Solid Freeform Fabrication Technology and could lead to new materials, construction methods and geometries into the world or electrical circuit design. The advancement in the high precision fluid control technologies nowadays makes it possible to deposit 0.1mm diameter of viscous fluid avoiding fluctuations in dispensing volume and fluid buildup. This study explore the possibility of directly dispense layers of high aspect ratio conductive patterns in-between stereolithography resin layers to fabricate parts with electrical functionality embedded in them.
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© 2005 The Japan Society for Precision Engineering
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