抄録
In this paper, we propose the inspection technique of wafer crystal defect by using microscope and image processing method. There are two main point as the issue in visual inspection. (1)Inspection results are unstable due to personal skill and fatigue. (2)Inspection takes much time. Therefor, automatic inspection system is desired. However, there are much mis-inspection in inspection system because of overlapped defects and dirt on wafer surface. We have applied Projection method to inspect defects correctly. Experiment results shows that the stable inspection results can be obtained by using the proposed technique.
