In this report, various amine hydrochloride flux action of soldering was studied on the relation between the reaction of flux with base metal or with Sn-Pb alloy solder and spreading phenomenon.
he experimental results obtained are as follows;
1) Aniline hydrochlord idie reacted with Sn-Pb alloy solder at 250°C to give SnCl
2, PbCl
2 and aniline.
The corrosion rate increased on going to Sn-36%Pb, to Sn-10%Pb and to Sn.
2) The addition of SnCl
2 to C
6H
5NH
2HCI had little effect on improement of spreading of Sn-Pb eutectic alloy solder, because SnCl
2 reacted with Pb in the solder to give PbCl
2 and the property of the solder changed greatly.
3) The increase in the corrosion rate of various fluxes with Cu plate caused the increase in spread of Sn solder with these fluxes.
4) Aniline hydrochloride reacted with Cu plate to give aniline and CuCl
2i which reacted with molten Sn to give SnCl
4 and Cu. And the Cu produced dissolved into Sn solder.
5) The addition of CuCl
2 to C
6H
5NH
2HCl had a great effect on improvement of spreading of all the solders, Sn, Sn-5%Pb and Sn-10%Pb. When CuCl
2 added to C
2H
5NH
2HCl, the effect was more great.
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