Preprints of the National Meeting of JWS

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Preprints of the National Meeting of JWS

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Study of deterioration of mechanical characteristics of solder joint under thermal circumstance

Yuki SHISHIHARA, Minoru EGUSA, Michiya MATSUSHIMA, Kozo FUJIMOTO

Session ID: 452
Published: 2008
Released on J-STAGE: October 28, 2008

DOIhttps://doi.org/10.14920/jwstaikai.2008f.0.452.0

CONFERENCE PROCEEDINGS FREE ACCESS

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Effect of Resin Properties on Thermal Cycle Fatigue Life of LSI Device Solder Joints

Norihiro Kobayashi, Masahiro Kusaka, Masaaki Kimura, Koichi Kaizu

Session ID: 453
Published: 2008
Released on J-STAGE: October 28, 2008

DOIhttps://doi.org/10.14920/jwstaikai.2008f.0.453.0

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The study on the reliability of lead-free solder joint in lead-frame interconnect structure of IGBT module

Kyohei Fukuda, Yuuji Iizuka, Tatsuhiko Asai, Ryousei Ikeda, Tomoaki Go ...

Session ID: 454
Published: 2008
Released on J-STAGE: October 28, 2008

DOIhttps://doi.org/10.14920/jwstaikai.2008f.0.454.0

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In this study, we have investigated the reliability of IGBT chip surface interconnection with the lead-frame structure. The heat dissipation characteristic is improved with lead-frame interconnection compared with the conventional wire interconnection. And the lead-frame interconnection with the Sn-Sb system solder has higher reliability than the Sn-Ag system.

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Improvement of Recognition Capability by Using Multi-Angle Image in Neuro Visual Inspection Systemu

Hiroyuki FUJIE, Naohiro KAWAI, Michiya MATSUSHIMA, Kozo FUJIMOTO

Session ID: 455
Published: 2008
Released on J-STAGE: October 28, 2008

DOIhttps://doi.org/10.14920/jwstaikai.2008f.0.455.0

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Effect of structures and operating conditions on temperature at catalyst layer in direct methanol fuel cell

Takushi Arimitsu, Masahiko Sugimura, Kozo FUJIMOTO

Session ID: 456
Published: 2008
Released on J-STAGE: October 28, 2008

DOIhttps://doi.org/10.14920/jwstaikai.2008f.0.456.0

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A study on the slub surface refining by magnetically deivn transferred arc

Hideki Hamatani, Kenichi Yamamoto, Sunao Takeuchi, Kenji Umedu, Takehi ...

Session ID: 457
Published: 2008
Released on J-STAGE: October 28, 2008

DOIhttps://doi.org/10.14920/jwstaikai.2008f.0.457.0

CONFERENCE PROCEEDINGS FREE ACCESS

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Effect of halogenation treatment on soldering of glass with application of voltage

Makoto TAKAHASHI, Kenji IKEUCHI

Session ID: 458
Published: 2008
Released on J-STAGE: October 28, 2008

DOIhttps://doi.org/10.14920/jwstaikai.2008f.0.458.0

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Effect of halogenation treatment that weakens the surface oxide of solder was examined in anodic soldering, in which glass and solder receive a voltage to improve contact between them. Exposure of the solder to HCl vapor improved extension of solder at the joint interface.

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Interfacial Microstructure between Gallium Nitride Single Crystal and Metal Films

Masakatsu Maeda, Hiroo Hatakawa, Yasuo Takahashi

Session ID: 459
Published: 2008
Released on J-STAGE: October 28, 2008

DOIhttps://doi.org/10.14920/jwstaikai.2008f.0.459.0

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Dielectric Properties of thin film Ba(Ti1-x Snx)O3

Teruhiko Sugioka, Minoru Nisida, Katusi Minakuti, Takanori Hino

Session ID: 460
Published: 2008
Released on J-STAGE: October 28, 2008

DOIhttps://doi.org/10.14920/jwstaikai.2008f.0.460.0

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Effect of BaHfO3 content on dielectric properties of Ba0.77Sr0.23TiO3 and making to thin film

Yoshihiro Kuroki, Minoru Nishida, Katushi Minakuti, Takanori Hino

Session ID: 461
Published: 2008
Released on J-STAGE: October 28, 2008

DOIhttps://doi.org/10.14920/jwstaikai.2008f.0.461.0

CONFERENCE PROCEEDINGS FREE ACCESS

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