Proceedings of Microelectronics Symposium

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MES2011

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MES2011

Development of Three-Dimensional Integration Modules Using Devices Embedded Substrate Technology

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 201-204
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_201

CONFERENCE PROCEEDINGS FREE ACCESS

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Development of transcription material for TMV-POP mounting

[in Japanese], [in Japanese], [in Japanese]

Pages 205-208
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_205

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Study on Packaging of Polymer MEMS Devices Based on Surface Activated Bonding and Micro Alignment-fitting Structures

[in Japanese], [in Japanese], [in Japanese]

Pages 209-212
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_209

CONFERENCE PROCEEDINGS FREE ACCESS

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A Study of EBG Structures applied Metamaterial Technology—Via-less EBG Structure for Noise— Suppression

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 213-216
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_213

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Verification of Common-Mode-Current Prediction Method Based on Imbalance Difference Model for Differential Signaling System

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 217-220
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_217

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Investigation for Signal Characteristic of High Density Interconnection with Micro Au Bumps

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 221-224
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_221

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Investigation of Wireless Power Transfer Using Electromagnetic Resonance

[in Japanese], [in Japanese], [in Japanese]

Pages 225-228
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_225

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Noise Analysis of Single-phase Full Bridge Inverter Circuit using SPICE Simulator

[in Japanese], [in Japanese], [in Japanese]

Pages 229-232
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_229

CONFERENCE PROCEEDINGS FREE ACCESS

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New Power Module Structure with High Power Density and High Reliability for SiC Devices

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 233-236
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_233

CONFERENCE PROCEEDINGS FREE ACCESS

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Silver paste with high thermal conductivity

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 237-240
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_237

CONFERENCE PROCEEDINGS FREE ACCESS

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Effect of Suppressing Power Noise on Decoupling Capacitor Embedded Interposer for 3-D Integrated System

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 241-244
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_241

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Investigation of EMI analysis method for power supply equivalent circuit of chip

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 245-248
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_245

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PCB Radiation Noise Suppression Method by Transfer Impedance Reduction of PCB Power Delivery System

[in Japanese], [in Japanese], [in Japanese]

Pages 249-252
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_249

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The shield print of the high frequency part by the vacuum print method of construction

[in Japanese]

Pages 253-256
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_253

CONFERENCE PROCEEDINGS FREE ACCESS

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Effect of Ni addition on structure of interfacial reaction layer

[in Japanese]

Pages 257-260
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_257

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Effects of Sb Addition on Impact Resistance Improvement of Sn-Bi Solder BGA Joints

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 261-264
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_261

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Microstructure of the Au-Ge solder/Ni(P) Interface

[in Japanese], [in Japanese], [in Japanese]

Pages 265-268
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_265

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Study on Calculation of the Effective Charge Number of Flip Chip Solder Joint on Electromigration

[in Japanese], [in Japanese], Jung Kyu Hau, Daechul Choi, King-Ning Tu

Pages 269-272
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_269

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Evaluation of a melting point elevatable low temperature solder material in electronicpackaging

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 273-276
Published: 2011
Released on J-STAGE: April 30, 2021

DOIhttps://doi.org/10.11486/mes.21.0_273

CONFERENCE PROCEEDINGS FREE ACCESS

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