Proceedings of Microelectronics Symposium

All issues

MES2016

Displaying 1-50 of 101 articles from this issue

Download citation

Show all abstracts

MES2016

The Latest Developments of the Power Device Package to Support The Power Electronics

[in Japanese], [in Japanese], [in Japanese]

Pages 15-22
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_15

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (1097K)
Investigation of Cu Connector Bonding Techniques on Power Modules

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 23-26
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_23

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (711K)
Thermal Simulation Modeling of a Toroidal Choke Coil

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 27-30
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_27

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (826K)
Reliability study of a package using novel heatsink comprised of laminated graphite and SiN

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 31-34
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_31

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (614K)
A Moisture Absorption Analysis for Power Device Packages

[in Japanese], [in Japanese], [in Japanese]

Pages 35-38
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_35

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (478K)
Solder Joints Reliability of Power Module for Automotive Applications

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 39-42
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_39

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (700K)
Low Temperature and Low Load Bonding Technology with Cu/Sn Paste for High Temperature Operating Power Modules

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 43-46
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_43

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (821K)
Effect of Sn crystallographic orientation on electromigration in Ni/Sn-Cu based solder bonding system for automotive

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 47-50
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_47

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (752K)
Analysis of Electromigration Induced Failure Mode in Cu/Ni/Sn-0.7Cu Joints for Automotive

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 51-54
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_51

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (788K)
Development of Package for power device using Pb-free die attach material with high heat dissipation

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 55-58
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_55

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (883K)
New approach to the formation of sophisticated implants using chemically surface modification and industrial applications

[in Japanese]

Pages 59-62
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_59

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (589K)
Influence of Kinds of Copper foil , Crystal Structure and Thickness of Electroless Ni-P on the Bend Durability of Copper Wiring

[in Japanese], [in Japanese], [in Japanese]

Pages 63-66
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_63

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (625K)
Electroless Ni-P Plating Applicable to Fine Pattern

[in Japanese], [in Japanese]

Pages 67-70
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_67

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (712K)
The Solder Ball Joint Reliability of Electroless Ni/Pd/Au Plating - Influence of the Phosphorus Concent and Thickness of Electroless Pd Plating Film -

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 71-74
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_71

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (579K)
Electromigration evaluation of ENEPIG plating film

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 75-78
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_75

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (759K)
Surface Treatment of Metal for Improvement of Cell Attachment and Extension

[in Japanese]

Pages 79-82
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_79

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (803K)
Direct Electroless Plating on Silicon Carbide

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 83-86
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_83

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (830K)
Study of reaction mechanism in Metal Assisted Chemical Etching for Si wafer dicing

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 87-90
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_87

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (755K)
Thick Copper Wiring on Thermosetting Resin Substrates by Nd:YVO₄ Green Laser

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 91-94
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_91

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (650K)
Formation and growth of intermetallic compound at Sn-Ag-Cu/Cu interface using laser soldering

[in Japanese], [in Japanese]

Pages 95-98
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_95

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (1566K)
Thermo-Sonic Flip Chip Methods on Copper or Solder Interconnect Structure

[in Japanese], [in Japanese]

Pages 99-102
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_99

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (779K)
Room-temperature wafer bonding in ambient air using thin Au capping layers for integrated reflectors in the ultraviolet spectral region

[in Japanese], [in Japanese], [in Japanese]

Pages 103-106
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_103

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (623K)
A Comparative Study between Formic Acid Atmosphere and Liquid Flux in Reflow Soldering

[in Japanese], [in Japanese]

Pages 107-110
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_107

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (736K)
Strengthening of pressure-free bonding with sintered Cu fine particles using Ni affinity layers and Cu-Ni alloy nanoparticles

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 111-114
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_111

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (534K)
SiC wafer bonding by surface activated bonding method

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 115-118
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_115

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (3671K)
High Reliable Bonding Technology by Intermetallic Compound (IMC) Pillar Dispersed Lead-free Solder Joint

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 119-122
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_119

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (880K)
Formation of voids in electronic packaging using hybrid resin including solder fillers

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 123-126
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_123

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (826K)
Property Improvement of Copper Filler Conductive Adhesive with Low Melting Point Metal

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 127-130
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_127

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (510K)
Depenendence of Binder Chemistry on Surface Modification Effect for Improving Electrical Conductivity of Electrically Conductive Adhesives with Cu-filler Loading

[in Japanese], [in Japanese], [in Japanese]

Pages 131-134
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_131

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (743K)
Transmission properties improvement of the build up board by the design improvement

[in Japanese], [in Japanese]

Pages 135-138
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_135

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (653K)
Transmission Characteristics and Electric Field Distribution around Human Body Standing on Surface Electrode of Floor for Human Body Communication

[in Japanese], [in Japanese], [in Japanese]

Pages 139-142
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_139

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (1097K)
Three Dimensional Broadband Antenna Consisting of Three Sets of Unbalanced Dipole Antennas Located with An Angle of 120 Degrees Each Other in H-plane

[in Japanese], [in Japanese], [in Japanese]

Pages 143-146
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_143

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (2500K)
Short-Range Wireless Communication Using Magnetic Resonance Coupling - Transmission Characteristics and Magnetic Field Distributions for Axial Mis-alignment between Coils

[in Japanese], [in Japanese], [in Japanese]

Pages 147-150
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_147

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (652K)
Human Body Communication in Underwater Environment

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 151-154
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_151

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (632K)
Assembly Technology for High Temperature Operation of Power Semiconductors

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 155-158
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_155

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (538K)
Development of High Temperature and High Speed Switching Power Module by Double Layer Active Metal brazing Copper Substrate Structure

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 159-162
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_159

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (1273K)
High Reliability Package Technology with New AlN Substrate for High Power IGBT Module

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 163-166
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_163

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (820K)
Analysis of parasitic factor with the mounting board of GaN-HEMT

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 167-170
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_167

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (737K)
Study on Creep Deformation Mechanism of Sintered Nano-sized Ag Particles

[in Japanese], [in Japanese]

Pages 171-174
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_171

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (740K)
Thermal reliability and stress control of the interconnection formed by using nano-Ag paste

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 175-178
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_175

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (844K)
Investigation on mass-production-ready sinter die-attach process for next-generation semiconductor power devices

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 179-182
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_179

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (925K)
Development of Pressure-less Sintering Copper Die-Bonding Paste (I) - Evaluation of Initial Bondability -

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 183-186
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_183

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (6554K)
Development of Pressure-less Sintering Copper Die-bonding Paste (II) - Thermal Performance of Sintered Copper as a Die-bonding Material for Power Devices -

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 187-190
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_187

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (727K)
Fabrication of Visible-light Responsive Photocatalytic Layer using Anodic Oxidation Process in Organic Electrolyte ‒Application to Antibacterial Materials‒

[in Japanese]

Pages 191-194
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_191

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (658K)
Fabrication of Sn based Collectors for Sodium-ion Secondary Batteries by using Electrochemical Technique

[in Japanese], [in Japanese], [in Japanese]

Pages 195-198
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_195

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (953K)
Sulfide Semiconductor Materials prepared by Electrodeposition and discussion of electrochemical reaction mechanism

[in Japanese], [in Japanese], [in Japanese]

Pages 199-202
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_199

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (582K)
Future Trends of Electronics Packaging technology for Automotive Electronics

[in Japanese]

Pages 203-206
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_203

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (689K)
Development of high performance heat pipe heat sink using inclined loop tube heat pipes

[in Japanese], [in Japanese], [in Japanese]

Pages 207-210
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_207

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (852K)
Cu wire bonding for automotive engine applications - An influence of the thermal stress -

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 211-214
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_211

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (878K)
Cu wire bonding for automotive engine applications. -Reduce Corrosive Constituent of Molding Compound Resin-

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 215-218
Published: 2016
Released on J-STAGE: November 29, 2019

DOIhttps://doi.org/10.11486/mes.26.0_215

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (933K)

Register with J-STAGE for free!