Journal of Quality Engineering Society
Online ISSN : 2189-9320
Print ISSN : 2189-633X
ISSN-L : 2189-633X
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Volume 2, Issue 6
Displaying 1-4 of 4 articles from this issue
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  • Application of Mahalanobis Distance for Medical Treatment
    Genichi Taguchi
    1994Volume 2Issue 6 Pages 2-6
    Published: December 01, 1994
    Released on J-STAGE: December 24, 2016
    DOIhttps://doi.org/10.18890/qes.2.6_2
    JOURNAL FREE ACCESS
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    After a diagonosis was done, the name of a disease is given and a medical treatment is applied. In this article it is recommended to use Mahalanobis Distance to evaluate the condition of the patient at certain intervals after the treatment. Let D02 be the initial Mahalanobis Distance and D2 be the Mahalanobis Distance at the time T elapsed, then following y may be used to see the efficiency of the treatment

    y=lnD02/D2

    An experimental design with minimum number of patients to compare the effectiveness of different treatments is also introduced in this article.

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  • Evalution　of Bending　Strength　Test From　Quality　Engineering　Viewpoint
    Takeshi Shirachi, Motohisa Ono, Katuhiko Tuchikura, Hiroshi Yano
    1994Volume 2Issue 6 Pages 18-25
    Published: December 01, 1994
    Released on J-STAGE: March 24, 2016
    DOIhttps://doi.org/10.18890/qes.2.6_18
    JOURNAL FREE ACCESS
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    In　the　strength　test　of　polymer　materials　by　the　flexual　test,　evaluation　was made　using　the　SN ratio　with　load　andspecimen　thickness　as　the　input　signals.　Traditionally,　the　quality　of　such　materials　kes　been　evaluated　mast　of　the　time　by　the　strength　at　break.　ln　this　study,　SN　ratios　were odtained　from　the　load/displacement,　curves　after　defining　the　elastic　and　plastic　deformation　domiains.　The　optimum　conditions　were　obtained　from　a　molding　experiment　using　molding　conditions　as　control　factors.　lt　was　clarified　that　the　results　of　verificaton　experiments　varied　depending on　how　the　SN　ratio　was　obtained.　Based　on　the　abobe　result,　conclusion　was　made　that　it　is　quite adequate　to　use　the　SN　ratios　from　the　load/displacement　curves　which　is　proposed　by　quality　engineering.
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  • Study　on　the　Generic　Function　of　a　Manufacturing Process　for　Cosmetics
    -from　tuning　the　appearance　to　optimizing　the　generic function-
    Hiroshi Fukasawa
    1994Volume 2Issue 6 Pages 26-32
    Published: December 01, 1994
    Released on J-STAGE: March 24, 2016
    DOIhttps://doi.org/10.18890/qes.2.6_26
    JOURNAL FREE ACCESS
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    In　this　paper,　the　optimization　on　the　generic　function　of　a　lipstick　manufacturing　process　is　discussed.　Traditionally,　the　quality　of　lipsticks　is　measured　by　objective　quality　characteristics　such as　appearance.　Sensory　tests,　which　are　not　recommended　in　quality　engineering,　had　been　used　to evaluate　such　quality　characteristics.　lt　is　because　these　quality　characteristics　are　not　stable　due　to the　changes　of　environ　mental　conditions　such　as　between　lot　variability　or　seasonal　variation. When　sucs　quality　problems　occur,　manufacturing　conditions　were　adjusted　from　time　to　time,which　is　known　as　fire　fighting　or　"mole　beating"　in　Japanese.　Among　those　objective　quality characteristics,　the　ones　such　as　scratches,　color　uniformity　or　breaking　during　usage　are　manu facturing　related　quality.　As　the　generic　function,　the　stress/strain　relationship　was　investigated and　the　results　showed　that　the　relationship　has　satisfied　the　Hooke's　Law　with　a　good　improvement.
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  • Fabrication　of　Through　holein　bump　photo　process
    Yusuke Watanabe, Koji lno, Hitosi Harada , Jyunji lshikawa
    1994Volume 2Issue 6 Pages 33-38
    Published: December 01, 1994
    Released on J-STAGE: March 24, 2016
    DOIhttps://doi.org/10.18890/qes.2.6_33
    JOURNAL FREE ACCESS
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    Since　the　80's,　the　utilization　of　hybrid　integrated　circuits　to　automobiles　have　been　increasing. There　is　a　well-known　trend　that　the　diameter　of　flipchip　bumps　are　becoming　smaller　and　smaller but　with　more　number　of　flipchip　bumps　in　a　circuit. ln　this　paper,the　development　of　the　fabrication　of　through　holes　by　the　bump　photo　process　to　produce　small　flipchip　bumps　using　thick　resist is　reported.　SN　ratio　was　used　for　the　analysis　to　maximize　the　uniformity　of　hole　dimentions.
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