マイクロビア技術は, 国によりビルドアップ, 逐次積層 (SBU) , 高密度コネクト (HDI) 等呼び方が変わるが, ファインラインアンドスペース, 微小ビアによる高密度基板技術のことである。マイクロビア技術は, ビア径150μmφ以下, パッド径350μmφで定義。マイクロビア技術の, つの市場すなわち, 基板, ICパッケージの需要動向について記述。また, マイクロビア技術の将来として, 到達するであろうライン/スペース, ビア径/パッド径についても記載。マイクロビア技術は, 将来ますます用途が広がり, 生産量も増え, 価格も下がってくるだろう。

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VLSIチップおよびパッケージのEMCに関する問題についていくつかの例をあげ, それぞれの問題についてモデリングの方法を示した。解析する問題の種類により, 利用すべきモデリング技術が異なるため, 与えられたモデルを, あるモデリング技術の適用が最適になるように分割し, 複数のモデリング技術を用いて解析を行う方法 (Multi-stage Modeling) について言及した。正しくEMIのモデリングを行うためには, 種類の異なるいくつかのモデリング技術が必要であり, 問題に合わせて使うべき技術を選択しなければならない。

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For smart textiles applications, textile compatible power supplies are required to ensure autonomous operation. Inspired by textile technologies, we have already developed an energy harvesting yarn where the spherical solar cell array is arranged in parallel. In this report, we show a new photovoltaic textile that weaves the energy harvesting yarn with the fabric weft, and some of its properties.

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For smart textiles applications, textile compatible power supplies have been highly anticipated to ensure autonomous operation. Inspired by textile technologies, we have successfully prototyped an energy harvesting yarn with a spherical solar cell array arranged in parallel.

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The new LTCC material has been developed by crystallization of glass compositions in the firing process so that the major amount of glass becomes cordierite. The new material has CTE (coefficient of thermal expansion) of .4-/degree Celsius and dielectric constant of .. The CTE of the new LTCC material is very close to that of silicon, which realizes high mounting reliability of a silicon device. We have measured the maximum principal stress in a silicon device mounted on test packages, using a piezoelectric element built-in the device. In the case of our new LTCC package, the stress in the device was around Mp, while a Build-Up package (CTE: 17. -/degree Celsius) has shown the stress about 80 MPa. Our new LTCC material can be co-fired with copper conductor, which realized high effective conductivity and low transmission loss. The new LTCC material has been confirmed to be a promising solution of packages for Low-k and Ultra Low-k devices.

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LSI suppliers have been making strong efforts to introduce LSI packages with lead free plating terminals. But, gull wing lead LSI packages still use Sn-Pb plating. Many papers report that the combination of Sn-Ag-Cu solder paste and Sn-Pb plating develops a low temperature layer on PWB copper pads and causes pad peel-off in the wave soldering process. This failure appears conspicuously in the case of low temperature solder alloys containing Bi such as Sn-Zn-Bi and Sn-Ag-In-Bi. This paper examines the composition of the low temperature layer and the peel-off limit temperature using an EPMA (Electron Probe Micro Analyzer), simulation software for the phase diagram, and an actual tensile test. As a result, the required control temperature for wave and selective soldering process is clarified.

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Until now printed wiring board (PWB) materials contain brominated flame-retardantes, and as a result there is concern that dioxin may be generated during combustion, and in the future these materials may be designated as regulation targets. We developed new resin system of UL94 V- with nitric and phosphoric flame retardantes. It has high humidity resistance and heat durability. We tackled the development of halogen-free materials ahead of other manufactures in the world, and we have merchandised FR-4 grade products.

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