Erratum: TSV (Through-Si-Via) Formation Technologies for Three-Dimensionally Stacked Chips
[Journal of Japan Institute of Electronics Packaging 12(2): 104-109 (2009)]

Abstract

Table 1. Trends in research and development of TSVs
-  2006 MRS [15] 2006 IEEE EDL [16] → 2006 MRS [15]
-  2006 IEEE EDL [16] 2006 SST [16] → 2006 IEEE EDL [16]
-  2007 SST [17] 2007 IEEE ED [17] → 2007 SST [17]
-  2008 IEEE ED [18] 2008 → 2008 IEEE ED [18]