Development of Laminate with Low Dielectric Loss Materials

Abstract

To adapt for high-frequency devices, we prepared a low dielectric loss (tanδ=0.001 at 10 GHz) material by blending a thermosetting poly(phenylene ether) copolymer (Allyl-PPE) with 1,2-bis(vinylphenyl)ethane (BVPE). The cured product shows good thermal and thermomechanical properties and it achieved flame retardancy (UL95 V-0) with a bromine-containing flame retardant. The copper-clad laminate using Allyl-PPE/BVPE showed both excellent performance in GHz signal transmission and good manufacturability.