Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Technical Papers
Whisker Test of Lead-Free Semiconductor Packages in Lead-Free Soldering
Akiko KobayashiKeiko ToiTakashi KajiharaMakoto TakeuchiKuniaki Takahashi
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2010 Volume 13 Issue 1 Pages 71-77

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Abstract
We evaluated the semiconductor mounting substrate and investigated the whisker's generations and factors by experimenting different environmental conditions. On the lead consisted of Cu base/Sn plating, the result of the condition 110°C/85% & 120°C/85% which were produced by Air-HAST (HAST with air) generates Sn whiskers faster than other high temperature and humidity tests. We concluded that the factors in the whisker generation are high temperatures, high moisture and oxygen.
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© 2010 The Japan Institute of Electronics Packaging
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