Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles: The Test Technology for the Next Generation Printed Board Assembly
Trends of Optical Inspection for High-Density PWBA
Yasunori Toyoshima
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2011 Volume 14 Issue 2 Pages 90-93

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