Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Micro-joining Technology
Development Status of Micro-Bump Interconnection Technologies
Kazushige ToriyamaKeishi OkamotoSayuri KoharaYasumitsu Orii
Author information
JOURNAL FREE ACCESS

2011 Volume 14 Issue 5 Pages 372-376

Details
Article 1st page
Content from these authors
© 2011 The Japan Institute of Electronics Packaging
Previous article Next article
feedback
Top