Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Packaging Technology
The Status and Trend of Inter Layer Insulating Materials for Semiconductor Packages
Hirohisa NarahashiShigeo Nakamura
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2011 Volume 14 Issue 5 Pages 398-403

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© 2011 The Japan Institute of Electronics Packaging
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