Abstract
Electronic products such as telecommunication systems, computers, and digital consumer electronics have come to require high-speed and high-density packaging. High-frequency electromagnetic field analysis is used for the printed-circuit board design of these products. For the analysis of the GHz-frequency characteristics of antennas, filters, resistors, capacitors, inductors and passive elements in wiring patterns, electromagnetic field analysis has proven to be suitable for the measurement well. However, a printed-circuit board is a large collection of interconnects, and even if a high-end personal computer is used, the analysis takes several days at least. Therefore, before fabrication, albeit is impossible to verify various aspects of the electromagnetic field analysis. Generally, if the analysis time has to be shortened from days to minutes, the subdivision modeling technique is used. In this case, the high-frequency analysis accuracy is unsatisfactory. In this paper we propose instead an accurate electromagnetic field solver for high-frequency characterization as a subdivision modeling technique using an EOSE (Enhanced Optimized Segment Extraction) method with multi-port S-parameter consideration of the coupling between transmission lines, based on the original, OSE (Optimized Segment Extraction) method. We evaluated this EOSE method for analysis time and high-frequency analysis accuracy in a multilayer printed-circuit board with via connections. The analysis time was confirmed to be about 1/6 that of the result analyzed in the whole of the structure. Furthermore, the analytic precision error was within 0.5 dB in the 5–8 GHz range when dividing in the continuous part of the transmission line. From these results, we showed the validity of this proposal technique.
