Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Lead-Free Electronics
Reliability Evaluation of High-Temperature-Resistant Joint Layer Formed by Silver Sintering Material
Masanori Yamagiwa
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2012 Volume 15 Issue 5 Pages 344-348

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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