Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / The Current and Future Prospect in Device Embedded Substrate
Intention to the Special Edition
Ichiro Koiwa
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2012 Volume 15 Issue 7 Pages 507

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Predecessor

HYBRIDS

Circuit Technology

Journal of SHM

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging
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