The 3D-Visualization of Conductive Pathway between Electrodes in Conductive Adhesive

Abstract

Previous studies of the macroscopic (the resistance after mounting) and microscopic (the contact resistance between fillers) measurements of conductive adhesives have made progress. However, the conduction mechanism between the electrodes of devices and circuit boards has not been clarified. This is because flat (2D) observations are usually used, though the acutual conductive behavior is three dimensional (3D). In this report, we observed the 3D-conductive line using FIB-SEM, with repeated polishing and observation. Our results show that we successfully analyzed an accurate model.