Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Organic Materials
Function and Design of Die-Bonding Film for Semiconductor Packages
Teiichi Inada
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2013 Volume 16 Issue 5 Pages 347-351

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HYBRIDS

Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging
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