Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Circuit Boad Thchnology for High-Speed Processing
Development of Copper Clad Laminate with Low Dielectric Loss Materials for High Frequency Devices
Jun Nunoshige
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2013 Volume 16 Issue 5 Pages 389-393

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Predecessor

HYBRIDS

Circuit Technology

Journal of SHM

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

Related journals
Transactions of The Japan Institute of Electronics Packaging
Proceedings of JIEP Annual Meeting
Proceedings of Microelectronics Symposium
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