Abstract
Flexible Printed Circuit boards (FPC) are used in various electronic devices due to their mechanical characteristics and are indispensable to electronic devices requiring smaller, thinner, and lighter production design, and multifunctionality. Although generally printed wired board has obtained adhesion strength between the insulation material and the conductor by the anchoring effect, fine-pattern productivity is difficult and high-frequency transmission loss due to the skin effect becomes larger. We have developed an innovative double-sided flexible printed circuit manufactured by direct copper plating on a polyimide film treated using a molecular junction agent. The adhesion strength between the copper and polyimide films is 15 N/cm and will degrade slightly after aging at 150°C for 168 h and at 260°C for 5 min. The new FPC has the advantages of thinness, weight, flexibility, fine pattern productivity, and high-frequency transmission properties compared to conventional FPCs. Moreover, this new FPC technology has great advantages in cost and environmental considerations.
