Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles
Application of Lignin for Epoxy-Based Thermoset Resin
Gen Komiya, Akihiko Happoya, Hirohisa Sagae, Akio Takahashi
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2014 Volume 17 Issue 2 Pages 117-122

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HYBRIDS

Circuit Technology

Journal of SHM

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

Related journals
Transactions of The Japan Institute of Electronics Packaging
Proceedings of JIEP Annual Meeting
Proceedings of Microelectronics Symposium
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