Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Latest Trends in Electromagnetic Characteristic Technology
Microwave and Millimeter-Wave Evaluation of Copper-Clad Dielectric Substrates
Yoshio Kobayashi
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2015 Volume 18 Issue 5 Pages 311-315

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Transactions of The Japan Institute of Electronics Packaging
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