Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Electronics Packaging Technology: The Current Status and Perspective
Fabrication of Cu/Polyimide Multilayer Interconnections by Low Temperature Nanoimprint in Polyimide
[in Japanese]
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2016 Volume 19 Issue 1 Pages 46-50

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© 2016 The Japan Institute of Electronics Packaging
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