Fabrication of Cu/Polyimide Multilayer Interconnections by Low Temperature Nanoimprint in Polyimide

Journal of The Japan Institute of Electronics Packaging

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

Special Articles / Electronics Packaging Technology: The Current Status and Perspective

Fabrication of Cu/Polyimide Multilayer Interconnections by Low Temperature Nanoimprint in Polyimide

[in Japanese]

Author information

JOURNAL FREE ACCESS

2016 Volume 19 Issue 1 Pages 46-50

DOI https://doi.org/10.5104/jiep.19.46

Details

Article 1st page

Content from these authors

© 2016 The Japan Institute of Electronics Packaging

Favorites & Alerts

Related articles

Recently viewed articles

Predecessor

Circuit Technology

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

Related journals

Transactions of The Japan Institute of Electronics Packaging

Proceedings of JIEP Annual Meeting

Proceedings of Microelectronics Symposium

Top