Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Latest Trend of Device Embedded Substrate Technology
Introduction to the Special Edition
Koji Ikawa
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2017 Volume 20 Issue 3 Pages 119

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© 2017 The Japan Institute of Electronics Packaging
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