The Influence that Via Structure and Its Near Wirings Give to Transmission Line Loss in High-Speed Transmission PCB

Abstract

In addition to low-dielectric-constant materials and skin effects of routing patterns, a routing technique that minimizes electromagnetic noise is essential to increase transmission speeds. Therefore, we need to consider reducing transmission losses caused by reflection and cross talk that results from the placement of through holes and traces closed to them as well as via structures on the core layer used in CPU packaging substrates. This paper uses a simulation method to confirm the influence on transmission losses of structures that consist of signal vias and traces closed to them in the routing design of high-signal-transmission PCBs.