Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Electronics Packaging Technology: The Current Status and Perspective
Latest Fan-Out Wafer Level Packaging Technologies for Realizing System Integration and Its Future Prospects
[in Japanese]
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2018 Volume 21 Issue 1 Pages 42-45

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