Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Electronics Packaging Technology: The Current Status and Perspective
Boundary-Scan Technology Essential for Quality Assurance of Device Embedded Substrates
[in Japanese]
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2018 Volume 21 Issue 1 Pages 57-61

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