Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Technical Paper
Validity of the Adhesive Strength Evaluation Method Based on the Intensity of Singular Stress Field in Two-Dimensional Modelling
Nao-aki NodaFei RenRei TakakiKenji TsuboiYoshikazu SanoYasushi TakaseTatsujiro Miyazaki
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2018 Volume 21 Issue 4 Pages 299-310

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Abstract

Our previous study showed that adhesive strength can be expressed as a constant value of the intensity of singular stress field (ISSF) by using two-dimensional modelling. In this paper, by considering the three-dimensional (3D) geometry, the mesh-independent technique proposed in our previous study is applied to evaluate the ISSF distributions along the side of a butt-joint interface. The results show that the critical ISSF distributions are almost the same and are independent of the adhesive thickness. The validity of the 2D modelling is confirmed through the present analysis.

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© 2018 The Japan Institute of Electronics Packaging
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