Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Design Tool
Dreams to Accelerate/Upgrade the Electromagnetic/Circuit Simulation~Toward Multi-Domain/Multi-Scale Simulation~
Hideki Asai
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2018 Volume 21 Issue 5 Pages 444-446

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Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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