Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Advanced Electronics Packaging Technologies in the IoT/5G Era
In the 5G Era, Trends in Board and Peripheral Technology Initiatives for Next-Generation Vehicles and Communication Technologies
Takaaki Domon
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2019 Volume 22 Issue 7 Pages 592-595

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© 2019 The Japan Institute of Electronics Packaging
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