Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Announcement, Contents, etc.
JIEP Mission Fellow
JOURNAL FREE ACCESS

2020 Volume 23 Issue 2 Pages 198

Details
Download PDF (416K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
© 2020 The Japan Institute of Electronics Packaging
Previous article Next article
Favorites & Alerts

Recently viewed articles
Predecessor

HYBRIDS

Circuit Technology

Journal of SHM

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

Related journals
Transactions of The Japan Institute of Electronics Packaging
Proceedings of JIEP Annual Meeting
Proceedings of Microelectronics Symposium
Share this page
feedback
 Top