Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Electronics Packaging Technology: The Current Status and Perspective
Technology Trends of Embedded Printed Circuit Board from the Viewpoint of Patents
[in Japanese]
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2021 Volume 24 Issue 1 Pages 56-62

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HYBRIDS

Circuit Technology

Journal of SHM

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging
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