Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Progress in Heat resistant Polymer
Materials for High Temperature Operation Power Module such as SiC Device
Akio Takahashi
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2021 Volume 24 Issue 5 Pages 436-443

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging
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