The Dry Ashing and Etching Technology for Advanced Packaging

Abstract

Advanced packaging demands higher performance, smaller size, and lower energy consumption. Thus, a wide variety of materials have been used and the writing layer has become denser. Against this background, the performance of plasma technology is required for advanced packaging in order to support miniaturization, a wide variety of materials, and various substrate shapes. This paper introduces a dry ashing process in redistribution layer production and a ULVAC dry-ashing system, called "NA-series". Ashing treatment has applications such as descum, controlling the surface shape, and surface modification. In the near future, plasma technology will be attracting increased attention due to the complexity and miniaturization of advanced packaging products.