Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Tutorial Series-Next Generation Packaging Technology of Power Electronic Devices Course / (3)
Joining Technology of Packaging for Power Semiconductor Devices
Yasushi Yamada
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2021 Volume 24 Issue 6 Pages 614-618

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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