Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Technical Paper
Analysis of Intensity of Singular Stress Field at the Stepped-Lap Joint
Nao-Aki NodaBiao WangSirui WangRei TakakiYoshikazu Sano
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2021 Volume 24 Issue 6 Pages 595-605

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Abstract

In this paper, the intensity of a singular stress field (ISSF) is focused and newly analyzed for a stepped-lap joint, and the adhesive strength is considered in terms of the ISSF. In this problem, it is necessary to analyze the two different singular stress fields at the interface end point A and each interface corner point Bi (i = 1,2…Ns-1, Ns = the number of steps) on the adhesive surface. Therefore, two different reference solutions are used in this study. The reference problem for point A is a butt joint having the same adhesive layer thickness as the stepped-lap joint. The reference problem for point Bi is chosen as a single rectangular fiber in an infinite plate under remote tension. In order to investigate the effect of the number of steps, Ns, on the ISSF of the stepped lap joint, four models with different numbers of steps are calculated. By comparing the stress distributions, we found that the ISSF at point A is larger than that at point Bi. Moreover, we also show that the ISSF at point A decreases with an increasing number of steps, Ns, but there is almost no change of the ISSF at point Bi.

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© 2021 The Japan Institute of Electronics Packaging
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