Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Technical Paper
SPICE Modeling of Phase Change Materials for Coupled Thermo-Electrical Simulation
Masatoshi IshiiTomoyuki HatakeyamaMasaru Ishizuka
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2022 Volume 25 Issue 1 Pages 123-132

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Abstract

We examined the SPICE model of phase change materials (PCM) suitable for the coupled analysis of heat and electricity. When a PCM is modeled by a switch, the model becomes complicated and unsuitable due to calculation speed. On the other hand, modeling with a dependent current source enables fast calculation with a simple model, but there are unstable factors in the analysis. Therefore, a dependent current source model is desirable if stability can be ensured. In this report, using the SPICE model of PCM with a dependent current source, it was shown that by carrying out calculation at a time step of 1/100 or less of the PCM thermal time constant, it could be stably analyzed without increasing errors, and it could be used for the thermal analysis of a cooling system for electronic equipment.

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© 2022 The Japan Institute of Electronics Packaging
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