Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Printed Circuit Board Technology for the Electronic Equipment in Society 5.0
Any Layer Structure Substrate with High Reliability Using Conductive Paste for Reducing Environmental Impact
Kenji Iida, Taiji Sakai
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2022 Volume 25 Issue 3 Pages 186-190

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Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging
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