Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Short Note
Temperature Distribution Simulation Model of Bus Bar Used as Heat Conduction Path
Yutaka KumanoShuhei FukunagaTsuyoshi Funaki
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2022 Volume 25 Issue 3 Pages 269-271

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Abstract

The joule heat resulting from the conduction current through a bus bar must be figured in when the bus bar is used as a heat conduction path to dissipate the heat of power devices. This paper verifies the temperature distribution in a bus bar stemming from both the heat conduction and the joule heat.

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© 2022 The Japan Institute of Electronics Packaging
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