Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Simulation Technologies of Electronics Packaging
3D-Stacked SRAM Using Near-Field Wireless Communication
Kota Shiba, Atsutake Kosuge, Mototsugu Hamada, Tadahiro Kuroda
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2022 Volume 25 Issue 6 Pages 549-555

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HYBRIDS

Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging
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